Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8519529 | Semiconductor package with lid bonded on wiring board and method of manufacturing the same | — | 2013-08-27 |
| 8309859 | Method of manufacturing a substrate, substrate, device provided with a substrate, and determining method | — | 2012-11-13 |
| 7378745 | Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns | Akimori Hayashi, Katsunobu Suzuki, Ryuichi Oikawa, Makoto Nakagoshi, Naoko Sera +4 more | 2008-05-27 |