Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7598760 | High temperature ceramic die package and DUT board socket | Adalberto M. Ramirez, Jens Ullmann, Jacob Herschmann, Robert J. Sylvia, Maurice C. Evans | 2009-10-06 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7598760 | High temperature ceramic die package and DUT board socket | Adalberto M. Ramirez, Jens Ullmann, Jacob Herschmann, Robert J. Sylvia, Maurice C. Evans | 2009-10-06 |