High temperature ceramic die package and DUT board socket

Assignee

• Qualitau

Inventors

• Thomas G. Bensing (1 patents)
• Adalberto M. Ramirez (5 patents)
• Jens Ullmann (13 patents)
• Jacob Herschmann (4 patents)
• Robert J. Sylvia (5 patents)
• Maurice C. Evans (16 patents)

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