Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7602201 | High temperature ceramic socket configured to test packaged semiconductor devices | Jose Ysaguirre, Jens Ullmann, Robert J. Sylvia | 2009-10-13 |
| 7598760 | High temperature ceramic die package and DUT board socket | Thomas G. Bensing, Jens Ullmann, Jacob Herschmann, Robert J. Sylvia, Maurice C. Evans | 2009-10-06 |
| 7172450 | High temperature open ended zero insertion force (ZIF) test socket | Robert J. Sylvia, Jens Ullmann, Jose Ysaguirre, Peter Cuevas, Maurice C. Evans | 2007-02-06 |
| 7082676 | Electrostatic discharge (ESD) tool for electronic device under test (DUT) boards | Robert J. Sylvia | 2006-08-01 |
| 6179640 | High temperature minimal (zero) insertion force socket | Robert Sikora, Maurice C. Evans, Yongbum Cuevas, Robert J. Sylvia | 2001-01-30 |