Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8742603 | Process for improving package warpage and connection reliability through use of a backside mold configuration (BSMC) | Omar J. Bchir, Milind Shah | 2014-06-03 |
| 8703602 | Selective seed layer treatment for feature plating | Omar J. Bchir, Milind Shah | 2014-04-22 |