Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784136 | Integrated module with electromagnetic shielding | Howard Joseph Holyoak | 2023-10-10 |
| 11139250 | Integrated module with electromagnetic shielding | Howard Joseph Holyoak | 2021-10-05 |
| 10410972 | Integrated module with electromagnetic shielding | Howard Joseph Holyoak | 2019-09-10 |
| 9936578 | Redistribution layer system in package | Thong Dang, Mark Charles Held | 2018-04-03 |
| 9807890 | Electronic modules having grounded electromagnetic shields | Thong Dang, Joseph Byron Bullis | 2017-10-31 |
| 9583471 | Integrated circuit module having a first die with a power amplifier stacked with a second die and method of making the same | Douglas Andrew Teeter, Ming Ji, Bhavin Shah, William Kent Braxton | 2017-02-28 |
| 8959757 | Method of manufacturing an electronic module | Thong Dang, Mark Charles Held | 2015-02-24 |
| 7732253 | Flip-chip assembly with improved interconnect | T. Scott Morris, Milind Shah | 2010-06-08 |