Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9583471 | Integrated circuit module having a first die with a power amplifier stacked with a second die and method of making the same | Douglas Andrew Teeter, Ming Ji, Bhavin Shah, Mohsen Haji-Rahim | 2017-02-28 |