Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11731413 | Attaching device and intermediate mechanism thereof, and attaching method | Yen-Dao Lee, Chun-Chieh Lu | 2023-08-22 |
| 11658046 | Semiconductor packaging structure with back-deposited shielding layer and manufacturing method thereof | Sheng-Tou Tseng, Kun-Chi Hsu, Chin-Ta Wu, Ting-Yeh Wu | 2023-05-23 |
| 11587808 | Chip carrier device | Sheng-Tou Tseng, Kun-Chi Hsu, Chin-Ta Wu, Ying Chen, Ting-Yeh Wu | 2023-02-21 |
| 11410945 | Semiconductor package having partial outer metal layer and packaging method thereof | Sheng-Tou Tseng, Kun-Chi Hsu, Chin-Ta Wu, Ying Chen, Ting-Yeh Wu | 2022-08-09 |
| 10863787 | Cover system | Li-Ray Chen | 2020-12-15 |
| 10713410 | Method for legalizing mixed-cell height standard cells of IC | Chao Wang, Yen-Yi Wu, Yao-Wen Chang, Meng-Kai Hsu | 2020-07-14 |
| 10275559 | Method for legalizing mixed-cell height standard cells of IC | Chao Wang, Yen-Yi Wu, Yao-Wen Chang, Meng-Kai Hsu | 2019-04-30 |
| 9627228 | Method for manufacturing a chip package having a coating layer | Sheng-I Huang, Ying Chen, Ta-Hao Chang, I-Fong Antonio Wu, Chi-Chung Yu | 2017-04-18 |
| 7331001 | Test card for multiple functions testing | Han-Jung Kao, Chun-Hsi Lin, Chih-Lang Lin, ShyhShin Lee | 2008-02-12 |