Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11658046 | Semiconductor packaging structure with back-deposited shielding layer and manufacturing method thereof | Shih-Chun Chen, Sheng-Tou Tseng, Chin-Ta Wu, Ting-Yeh Wu | 2023-05-23 |
| 11587808 | Chip carrier device | Shih-Chun Chen, Sheng-Tou Tseng, Chin-Ta Wu, Ying Chen, Ting-Yeh Wu | 2023-02-21 |
| 11410945 | Semiconductor package having partial outer metal layer and packaging method thereof | Shih-Chun Chen, Sheng-Tou Tseng, Chin-Ta Wu, Ying Chen, Ting-Yeh Wu | 2022-08-09 |
| 10388535 | Wafer processing method with full edge trimming | Chui-Liang CHIU, Jen-Tung Tseng, Chin-Ta Wu | 2019-08-20 |