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Kun-Chi Hsu — 4 Patents

PTPowertech Technology: 4 patents #22 of 136Top 20%
Hengshan, TW: #485 of 1,564 inventorsTop 35%
Overall (All Time): #1,080,739 of 4,157,543Top 30%
4 Patents All Time
Kun-Chi Hsu has been granted 4 US patents while listed as an inventor at Powertech Technology. The first was granted in 2019 and the most recent in May 2023. Kun-Chi Hsu ranks #1,080,739 of 4,157,543 US inventors in our database (top 26.0%). Patent records list Kun-Chi Hsu in Hengshan, TW.

Patents per Year

Patents granted per year, 2019 to 2023Bar chart with a peak of 2 patents in 2023.peak 22019: 1 patents20192022: 1 patents20222023: 2 patents2023

Issued Patents All Time

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
11658046 Semiconductor packaging structure with back-deposited shielding layer and manufacturing method thereof Shih-Chun Chen, Sheng-Tou Tseng, Chin-Ta Wu, Ting-Yeh Wu 2023-05-23
11587808 Chip carrier device Shih-Chun Chen, Sheng-Tou Tseng, Chin-Ta Wu, Ying Chen, Ting-Yeh Wu 2023-02-21
11410945 Semiconductor package having partial outer metal layer and packaging method thereof Shih-Chun Chen, Sheng-Tou Tseng, Chin-Ta Wu, Ying Chen, Ting-Yeh Wu 2022-08-09
10388535 Wafer processing method with full edge trimming Chui-Liang CHIU, Jen-Tung Tseng, Chin-Ta Wu 2019-08-20

Frequent Collaborators

Chin-Ta Wu4 shared
Sheng-Tou Tseng3 shared
Ting-Yeh Wu3 shared
Shih-Chun Chen3 shared
Ying Chen2 shared
Chui-Liang CHIU1 shared

Nearby-Ranked Inventors

Jagadeesh Kandasamy4
Ross CABOT4
George Ueda4
Franz A. Gruswitz4
Tommy Glimberg4
Vinayakaraddy Gulabal4
Sandra Bittorf4
Aviel FOGEL4
Eric Matthew Walton4