Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12384950 | Heat-dissipating composition, heat-dissipating member, and filler aggregate for heat-dissipating member | Masataka Sugimoto, Abison SCARIA, Taku Sasaki, Hidehito NISHIZAWA, Masafumi Yoshida +3 more | 2025-08-12 |
| 9188742 | Teraherz-wave connector and teraherz-wave integrated circuits, and wave guide and antenna structure | Masayuki Fujita, Tadao Nagatsuma, Dai Onishi, Eiji Miyai | 2015-11-17 |
| 7347955 | Heat conducting polymer mold products | Masayuki Tobita, Naoyuki Shimoyama, Hisashi Aoki, Toru Kimura, Tsunehisa Kimura +1 more | 2008-03-25 |
| 7189778 | Thermally conductive polymer molded article and method for producing the same | Masayuki Tobita, Naoyuki Shimoyama, Toru Kimura | 2007-03-13 |
| 7079405 | Thermal conductive polymer molded article and method for producing the same | Masayuki Tobita, Toru Kimura, Naoyuki Shimoyama | 2006-07-18 |