Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7540991 | Ion conductive polymer electrolyte membrane and production method for the same | Naoyuki Shimoyama, Fumio Saitoh, Toru Kimura | 2009-06-02 |
| 7347955 | Heat conducting polymer mold products | Naoyuki Shimoyama, Tsukasa Ishigaki, Hisashi Aoki, Toru Kimura, Tsunehisa Kimura +1 more | 2008-03-25 |
| 7291381 | Thermally conductive formed article and method of manufacturing the same | Naoyuki Shimoyama, Shinya Tateda, Tsunehisa Kimura, Masafumi Yamato | 2007-11-06 |
| 7264869 | Thermally conductive molded article and method of making the same | Naoyuki Shimoyama, Shinya Tateda | 2007-09-04 |
| 7189778 | Thermally conductive polymer molded article and method for producing the same | Naoyuki Shimoyama, Tsukasa Ishigaki, Toru Kimura | 2007-03-13 |
| 7122617 | Polybenzazole precursor film, polybenzazole film and method of producing the same | Fumio Saitoh, Toru Kimura, Masatoshi Hasegawa | 2006-10-17 |
| 7090478 | Apparatus and method for manufacturing an anisotropic formed body | Hitoshi Wada, Tsukasa Kiyoshi, Eiji Homma, Hideaki Konno | 2006-08-15 |
| 7079405 | Thermal conductive polymer molded article and method for producing the same | Toru Kimura, Naoyuki Shimoyama, Tsukasa Ishigaki | 2006-07-18 |
| 6918983 | Adhesion method and electronic component | Shinya Tateda, Tsunehisa Kimura, Masahumi Yamato | 2005-07-19 |
| 6808798 | Heat conductive resin substrate and semiconductor package | — | 2004-10-26 |
| 6794035 | Graphitized carbon fiber powder and thermally conductive composition | Naoyuki Shimoyama, Shinya Tateda | 2004-09-21 |
| 6761842 | Heat conductive mold and manufacturing method thereof | Shinya Tateda, Tsunehisa Kimura, Masahumi Yamato | 2004-07-13 |
| 6730731 | Thermally conductive polymer composition and thermally conductive molded article | Natsuko Ishihara, Naoyuki Shimoyama, Shinya Tateda | 2004-05-04 |
| 6652958 | Thermally conductive polymer sheet | — | 2003-11-25 |
| 6451418 | Heat conductive resin substrate and semiconductor package | — | 2002-09-17 |
| 6166402 | Pressure-contact type semiconductor element and power converter thereof | Kazuya Kodani, Toshiaki Matsumoto | 2000-12-26 |