{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Chip-to-chip interconnect with embedded electro-optical bridge structures", "item": "https://www.patentleaderboard.com/patent/9971089"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Chip-to-chip interconnect with embedded electro-optical bridge structures

Chip-to-chip interconnect with embedded electro-optical bridge structures

US Patent 9971089 · Granted May 15, 2018

Estimated economic value: $21,346,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Ground via clustering for crosstalk mitigation2025
Ultra-thin, hyper-density semiconductor packages2025
Multi-chip packaging2025
Heterogenous socket contact for electrical and mechanical performance scaling in2025
Heterogenous socket contact for electrical and mechanical performance scaling in2025
Ultra-thin, hyper-density semiconductor packages2025
Planar integrated circuit package interconnects2025
Glass substrates having signal shielding for use with semiconductor packages and2025
Semiconductor device stack-up with bulk substrate material to mitigate hot spots2025
Substrateless double-sided embedded multi-die interconnect bridge2025
Coreless electronic substrates having embedded inductors2025
LED filament and LED light bulb2025