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Home › Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines

Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines

US Patent 9929121 · Granted Mar 27, 2018

Estimated economic value: $16,246,000 ⓘ

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