Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for packaging a microelectronic device in a hermetically sealed cavity and managing the atmosphere of the cavity with a dedicated hole

Method for packaging a microelectronic device in a hermetically sealed cavity and managing the atmosphere of the cavity with a dedicated hole

US Patent 9908773 · Granted Mar 6, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electromechanical device with adjustable resonance frequency2025
Electromechanical microsystem2024
RF filter device2024
Transmit or reflectarray antenna cell2024
Etch stop and protection layer for capacitor processing in electroacoustic devic2024
Electromechanical microsystem2024
Stack for fabricating an integrated circuit intended to perform an electromagnet2024
Process for the exposure of a region on one face of an electronic device2020
RF/DC decoupling system for RF switches based on phase change material2020
RF/DC decoupling system for RF switches based on phase change material2020
Inductance device and method of manufacturing the same2020
Inductance device and method of manufacturing the same2020