Composition for metal plating comprising suppressing agent for void free submicron feature filling

Assignee

• Basf Se

Inventors

• Cornelia Roeger-Goepfert (21 patents)
• Roman Benedikt Raether (33 patents)
• Alexandra Haag (5 patents)
• Dieter Mayer (47 patents)
• Charlotte Emnet (15 patents)

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