Resin composition, copper clad laminate and printed circuit board using same

Assignee

• Elite Electronic Material (Kunshan) Co.

Inventors

• Rongtao WANG (28 patents)
• Yu-Te Lin (28 patents)
• Wenjun Tian (8 patents)
• Ziqian Ma (9 patents)
• Wenfeng Lv (5 patents)
• Ningning Jia (16 patents)

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