Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10626251 | Resin composition and articles made therefrom | Xingxing Yao, Rongtao WANG, Yan Zhang, Bingbing Li, Zhenfang SHANG +1 more | 2020-04-21 |
| 10072148 | Resin composition, copper clad laminate and printed circuit board using same | Rongtao WANG, Yu-Te Lin, Wenjun Tian, Wenfeng Lv, Ningning Jia | 2018-09-11 |
| 9850375 | Resin composition, copper clad laminate and printed circuit board using same | Rongtao WANG, Yu-Te Lin, Wenjun Tian, Wenfeng Lv, Ningning Jia | 2017-12-26 |
| 9650512 | Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same | RONG-TAO WANG, Li-Chih Yu, Yu-Te Lin, Yi-Jen Chen, Wenjun Tian +1 more | 2017-05-16 |
| 9574070 | Aromatic tetrafunctional vinylbenzyl resin composition and use thereof | Rongtao WANG, Chen-Yu Hsieh, Wenfeng Lv, Wenjun Tian, Yu Gao +1 more | 2017-02-21 |
| 9469757 | Low dissipation factor resin composition and product made thereby | Rongtao WANG, Chen-Yu Hsieh, Wenfeng Lv, Wenjun Tian, Yu Gao +1 more | 2016-10-18 |
| 9447238 | Polyphenylene oxide resin, method of preparing polyphenylene oxide resin, polyphenylene oxide prepolymer and resin composition | Yu Gao, Chen-Yu Hsieh, Rongtao WANG, Wenjun Tian | 2016-09-20 |
| 9402310 | Low-dielectric resin composition and copper-clad laminate and printed circuit board using the same | Rongtao WANG, Chen-Yu Hsieh, Wenjun Tian, Wenfeng Lv | 2016-07-26 |
| 9131607 | Lowdielectric resin composition, copper clad laminate using the same, and printed circuit board using the same | RONG-TAO WANG, Tse-An Lee, Yi-Jen Chen, Wenjun Tian, Wenfeng Lu | 2015-09-08 |