LY

Li-Chih Yu

EC Elite Material Co.: 7 patents #2 of 32Top 7%
EC Elite Electronic Material (Kunshan) Co.: 2 patents #17 of 27Top 65%
EC Elite Electronic Material (Zhongshan) Co.: 2 patents #10 of 29Top 35%
📍 Zhubei City, TW: #129 of 1,506 inventorsTop 9%
Overall (All Time): #370,203 of 4,157,543Top 9%
13
Patents All Time

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
12092601 Construction method for photocathode indirect competition sensor and evaluation method Zhaowei Zhang, Wenqin Wu, Xiao Xiao Chen, Ling Cheng, Xiupin Wang +1 more 2024-09-17
10073141 Detecting method and apparatus for abnormal electrical connection in main circuit of switchgear Fangji Wu, Jiong Chen, Zuhui Li 2018-09-11
9955569 Multi-layer printed circuit boards with dimensional stability Ya-Wen Kuo, Ching-Hsin Ho 2018-04-24
9650512 Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same RONG-TAO WANG, Yu-Te Lin, Yi-Jen Chen, Wenjun Tian, Ziqian Ma +1 more 2017-05-16
9545018 Multi-layer printed circuit boards with dimensional stability Ya-Wen Kuo, Ching-Hsin Ho 2017-01-10
9422412 Halogen-free resin composition and copper clad laminate and printed circuit board using same Tse-An Lee 2016-08-23
9394438 Resin composition, copper-clad laminate and printed circuit board for use therewith Tse-An Lee 2016-07-19
9392683 Multi-layer printed circuit boards having properties suitable for layer reduction design Ming-Chuan Chang, Yu-Te Lin 2016-07-12
9288904 Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same RONG-TAO WANG, Li-Ming Chou, Yu-Te Lin 2016-03-15
9279051 Halogen-free resin composition, and copper clad laminate and printed circuit board using same Tse-An Lee 2016-03-08
9238733 Halogen-free resin composition Chang-Yuan Li, Li-Ming Chou, Tse-An Lee 2016-01-19
9185801 Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same Chang-Yuan Li, Hong Peng 2015-11-10
8404764 Resin composition and prepreg, laminate and circuit board thereof Tse-An Lee, Jen-Chun Wang, Yu-Te Lin, Yih-Rern Peng 2013-03-26