Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10072148 | Resin composition, copper clad laminate and printed circuit board using same | Rongtao WANG, Yu-Te Lin, Wenjun Tian, Ziqian Ma, Ningning Jia | 2018-09-11 |
| 9850375 | Resin composition, copper clad laminate and printed circuit board using same | Rongtao WANG, Yu-Te Lin, Wenjun Tian, Ziqian Ma, Ningning Jia | 2017-12-26 |
| 9574070 | Aromatic tetrafunctional vinylbenzyl resin composition and use thereof | Rongtao WANG, Chen-Yu Hsieh, Wenjun Tian, Yu Gao, Ningning Jia +1 more | 2017-02-21 |
| 9469757 | Low dissipation factor resin composition and product made thereby | Rongtao WANG, Chen-Yu Hsieh, Wenjun Tian, Yu Gao, Ningning Jia +1 more | 2016-10-18 |
| 9402310 | Low-dielectric resin composition and copper-clad laminate and printed circuit board using the same | Rongtao WANG, Chen-Yu Hsieh, Wenjun Tian, Ziqian Ma | 2016-07-26 |