Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package structure and fabrication method thereof

Package structure and fabrication method thereof

US Patent 9842758 · Granted Dec 12, 2017

Estimated economic value: $446,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Chip matching system and method thereof2024
Method of manufacturing substrate structure with filling material formed in conc2024
Chip matching system and method thereof2022
Method for fabricating substrate structure2022
Identity authentication method and apparatus2022
Electronic package and substrate structure having chamfers2022
Substrate structure, electronic package having the same, and method for fabricat2021
Substrate structure having chamfers2020
Identity authentication method and apparatus2020
Substrate structure with filling material formed in concave portion2019
Method and device for playing advertisements based on relationship information b2019
Taking personalized photos2019