Semiconductor package and manufacturing method thereof

Assignee

• Amkor Technology

Inventors

• Jae Ung Lee (19 patents)
• Byong Jin Kim (63 patents)
• Young Seok Kim (178 patents)
• Wook Choi (11 patents)
• Seung Jae Yoo (11 patents)
• Yung Woo Lee (15 patents)
• EunNaRa Cho (13 patents)
• Dong Hyun Bang (13 patents)

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