Chemical mechanical polishing pad, polishing layer analyzer and method

Assignee

• Rohm And Haas Electronic Materials Cmp Holdings
• Dow Global Technologies

Inventors

• Francis V. Acholla (5 patents)
• Andrew Wank (18 patents)
• Mark Gazze (6 patents)
• Scott Chang (3 patents)
• Jeff Tsai (4 patents)
• William A. Heeschen (7 patents)
• James D. Tate (6 patents)
• Leo H. Chiang (3 patents)
• Swee-Teng Chin (3 patents)

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