Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device packages and method of making the same

Semiconductor device packages and method of making the same

US Patent 9653415 · Granted May 16, 2017

Estimated economic value: $1,763,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Multi-moldings fan-out package and process2021
Multi-moldings fan-out package and process2021
Semiconductor package device and method of manufacturing the same2020
Semiconductor device including electric and magnetic field shielding2018
Semiconductor device including electric and magnetic field shielding2018
Semiconductor device including electric and magnetic field shielding2018
Semiconductor package device and method of manufacturing the same2018
Semiconductor device package and a method of manufacturing the same2018
Semiconductor device package and method of manufacturing the same2016
Semiconductor device package and method of manufacturing the same2016
Semiconductor device package and method of manufacturing the same2016
Low noise amplifier and receiver2015