Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Component including two semiconductor elements, which are bonded to one another via a structured bonding layer, and method for manufacturing a component of this type

Component including two semiconductor elements, which are bonded to one another via a structured bonding layer, and method for manufacturing a component of this type

US Patent 9650240 · Granted May 16, 2017

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Micromechanical component for a rotation rate sensor2025
Micromechanical component for a sound transducer and corresponding production me2025
Micromechanical sensor structure with damping structure2025
Sensor device for measuring a temperature difference in a computer chip system2025
Method for producing a bonding pad for a micromechanical sensor element2025
Method for operating a photodiode and device for carrying out the method2025
Contact lens, method for detecting a structure-borne sound with the aid of a con2025
Sensor system, method for operating a sensor system2025
Micromechanical component for a sensor device2025
Method for manufacturing a MEMS switch having an embedded metal contact2025
MEMS relay2025
Micromechanical component, in particular, inertial sensor, including a seismic m2025