Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Device with vertically integrated sensors and method of fabrication

Device with vertically integrated sensors and method of fabrication

US Patent 9586812 · Granted Mar 7, 2017

Estimated economic value: $8,166,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of integrating a copper plating process in a through-substrate-via (TSV) 2019
Method of integrating a copper plating process in a through-substrate-via (TSV) 2017
Semiconductor die with high pressure cavity2016
Microelectromechanical systems (MEMS) devices with control circuits and methods 2016
Method of fabricating MEMS device having release etch stop layer2015
Magnetic sensing device for navigation and detecting inclination2010
Method of making MEMS wafers2010
Sensor packaging method for a human contact interface2009