Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10347564 | Method of integrating a copper plating process in a through-substrate-via (TSV) on CMOS wafer | Qing Zhang, Mohommad Choudhuri, Gul Zeb | 2019-07-09 |
| 9704784 | Method of integrating a copper plating process in a through-substrate-via (TSV) on CMOS wafer | Qing Zhang, Mohommad Choudhuri, Gul Zeb | 2017-07-11 |
| 9586812 | Device with vertically integrated sensors and method of fabrication | Mamur Chowdhury | 2017-03-07 |
| 9416003 | Semiconductor die with high pressure cavity | — | 2016-08-16 |
| 8932893 | Method of fabricating MEMS device having release etch stop layer | — | 2015-01-13 |
| 7832111 | Magnetic sensing device for navigation and detecting inclination | Yaohui Mao | 2010-11-16 |
| 7617599 | Sensor packaging method for a human contact interface | Zongya Li, Hongyuan Yang, Yanwei Chen | 2009-11-17 |