Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10347564 | Method of integrating a copper plating process in a through-substrate-via (TSV) on CMOS wafer | Matthieu Lagouge, Qing Zhang, Gul Zeb | 2019-07-09 |
| 10336606 | Integrated capacitive humidity sensor | Qing Zhang, Gul Zeb | 2019-07-02 |
| 9704784 | Method of integrating a copper plating process in a through-substrate-via (TSV) on CMOS wafer | Matthieu Lagouge, Qing Zhang, Gul Zeb | 2017-07-11 |