Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor packaging containing sintering die-attach material

Semiconductor packaging containing sintering die-attach material

US Patent 9583453 · Granted Feb 28, 2017

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Lithographically defined electrical interconnects from conductive pastes2025
Methods for electrochemical additive manufacturing of parts2025
Conductive film adhesive2024
Conductive film adhesive2024
Systems and methods for electrochemical additive manufacturing of parts using mu2024
Alternative compositions for high temperature soldering applications2022
Metallic adhesive compositions having good work lives and thermal conductivity, 2022
Sintering pastes with high metal loading for semiconductor die attach applicatio2020
Sintering pastes with high metal loading for semiconductor die attach applicatio2020
Sintering pastes with high metal loading for semiconductor die attach applicatio2020
Structures for z-axis interconnection of multilayer electronic substrates2017
Electrically conductive compositions comprising non-eutectic solder alloys2015