Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Alternative compositions for high temperature soldering applications

Alternative compositions for high temperature soldering applications

US Patent 11440142 · Granted Sep 13, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Lithographically defined electrical interconnects from conductive pastes2025
Conductive film adhesive2024
Metallic adhesive compositions having good work lives and thermal conductivity, 2022
Sintering pastes with high metal loading for semiconductor die attach applicatio2020
Semiconductor packaging containing sintering die-attach material2017
Structures for z-axis interconnection of multilayer electronic substrates2017
Electrically conductive compositions comprising non-eutectic solder alloys2015
Preparation of metallurgic network compositions and methods of use thereof2014
Conductive compositions containing blended alloy fillers2012