Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Sintering pastes with high metal loading for semiconductor die attach applications

Sintering pastes with high metal loading for semiconductor die attach applications

US Patent 10727193 · Granted Jul 28, 2020

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Lithographically defined electrical interconnects from conductive pastes2025
Methods for electrochemical additive manufacturing of parts2025
Conductive film adhesive2024
Conductive film adhesive2024
Systems and methods for electrochemical additive manufacturing of parts using mu2024
Alternative compositions for high temperature soldering applications2022
Metallic adhesive compositions having good work lives and thermal conductivity, 2022
Semiconductor packaging containing sintering die-attach material2017
Semiconductor packaging containing sintering die-attach material2017
Semiconductor packaging containing sintering die-attach material2017
Structures for z-axis interconnection of multilayer electronic substrates2017
Electrically conductive compositions comprising non-eutectic solder alloys2015