Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Epoxy resin composition and copper clad laminate manufactured by using same

Epoxy resin composition and copper clad laminate manufactured by using same

US Patent 9475970 · Granted Oct 25, 2016

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Resin composition and use thereof2025
Resin composition and application thereof2025
Resin composition, prepreg containing same, laminate, and printed circuit board2024
Fluorine-containing resin composition, and resin vanish, fluorine-containing die2024
Composite, high-frequency circuit substrate prepared therefrom and process for p2023
Thermosetting resin composition, prepreg made therefrom, laminate clad with meta2022
Thermosetting resin composition, prepreg made therefrom, laminate clad with meta2022
Thermosetting resin composition, prepreg, laminate, and printed circuit board2022
Circuit board and process for preparing the same2021
Vinyl thermosetting resin composition, prepreg, laminate, and printed circuit bo2021
Halogen-free thermosetting resin composition, prepreg, laminate and printed circ2019
Degradable resin composition, and prepreg, laminate and copper clad laminate usi2019