Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Mechanism for MEMS bump side wall angle improvement

Mechanism for MEMS bump side wall angle improvement

US Patent 9466541 · Granted Oct 11, 2016

Estimated economic value: $5,782,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Ion beam etching chamber with etching by-product redistributor2025
Semiconductor device and method for fabricating the same2025
Comb electrode release process for MEMS structure2025
Ion beam etching chamber with etching by-product redistributor2025
Semiconductor device and method of making2025
Wafer chuck structure with holes in upper surface to improve temperature uniform2025
Sonar sensor in processing chamber2024
Dielectric sidewall structure for quality improvement in Ge and SiGe devices2024
Process and related device for removing by-product on semiconductor processing c2024
Method for mapping wafers in a wafer carrier2024
System and method providing risk relationship transaction automation in accordan2024
Semiconductor device and method of making2024