Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer chuck structure with holes in upper surface to improve temperature uniformity

Wafer chuck structure with holes in upper surface to improve temperature uniformity

US Patent 12272585 · Granted Apr 8, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Ion beam etching chamber with etching by-product redistributor2025
Participant data synchronization in videoconferencing2025
Semiconductor device and method for fabricating the same2025
Semiconductor device and method for fabricating the same2025
Comb electrode release process for MEMS structure2025
Comb electrode release process for MEMS structure2025
Ion beam etching chamber with etching by-product redistributor2025
Semiconductor device and method of making2025
Semiconductor device and method of making2025
Source/drain feature separation structure2025
Cable arrangement mechanism2025
Top notch slit profile for MEMS device2025