Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Chip package structure and manufacturing method thereof

Chip package structure and manufacturing method thereof

US Patent 9437529 · Granted Sep 6, 2016

Estimated economic value: $2,328,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Timing calibration system and a method thereof2020
Multi-chip package structure manufacturing process and wafer level chip package 2018
Manufacturing process of wafer level chip package structure having block structu2018
Manufacturing method of chip package structure2017
Manufacturing method of chip package structure2017
Multi-chip package structure, wafer level chip package structure and manufacturi2017
Multi-chip package structure having blocking structure, wafer level chip package2017
Semiconductor package structure and manufacturing method thereof2015
Chip package structure and manufacturing method thereof2014
Chip package structure and manufacturing method thereof2014
Semiconductor package structure and manufacturing method thereof2014
Semiconductor package structure and manufacturing method thereof2014