Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Shield lid interconnect package and method

Shield lid interconnect package and method

US Patent 9433117 · Granted Aug 30, 2016

Estimated economic value: $5,950,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Secure permissioning of access to user accounts, including secure deauthorizatio2025
Semiconductor package with routing patch and method of fabricating the semicondu2025
Semiconductor device with tiered pillar and manufacturing method thereof2024
Semiconductor package with front side and back side redistribution structures an2024
Secure permissioning of access to user accounts, including secure distribution o2024
Semiconductor device package and manufacturing method thereof2024
Shielded electronic component package2024
Shielded electronic component package2024
Shielded electronic component package2024
Shielded electronic component package2024
Shielded electronic component package2024
Secure permissioning of access to user accounts, including secure deauthorizatio2024