Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods for fabricating integrated circuits using directed self-assembly

Methods for fabricating integrated circuits using directed self-assembly

US Patent 9275896 · Granted Mar 1, 2016

Estimated economic value: $579,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Optical system and assay chip for probing, detecting and analyzing molecules2025
Stitching to enable dense interconnect arrangements2025
Integrated sensor2025
Power rail between fins of a transistor structure2025
Optical and electrical secondary path rejection2025
Systems and methods of making polymeric optical layers for optical layering2025
Gate-all-around integrated circuit structures having germanium-diffused nanoribb2025
Source/drain regions in integrated circuit structures2025
Optical microdisks for integrated devices2025
Gate spacing in integrated circuit structures2025
Self-aligned lateral contacts2025
Integrated sensor for lifetime characterization2025