Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Conductive via structures for routing porosity and low via resistance, and processes of making

Conductive via structures for routing porosity and low via resistance, and processes of making

US Patent 9224642 · Granted Dec 29, 2015

Estimated economic value: $12,350,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Circuit and method to measure simulation to silicon timing correlation2025
Circuit and method to measure simulation to silicon timing correlation2025
Circuit and method to measure simulation to silicon timing correlation2023
Frequency locked loops and related circuits and methods2022
Method and apparatus of dual threshold clock control2020
Standard cell circuitries2019
Dynamic power meter with improved accuracy and single cycle resolution2019
Fast and Autonomous mechanism for CPU OC protection2019
Dual-rail power equalizer2017
Control method of clock gating for dithering in the clock signal to mitigate vol2017
Reduction in power supply induced jitter on a SerDes transmitter2015
Conductive via structures for routing porosity and low via resistance, and proce2014