Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Double self aligned via patterning

Double self aligned via patterning

US Patent 9219007 · Granted Dec 22, 2015

Estimated economic value: $2,572,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Metal lines with low via-to-via spacing2025
Top via containing random-access memory cross-bar array2025
Methods for preparing small features on a substrate2025
Electronic devices with a low dielectric constant2025
MRAM top electrode structure with liner layer2025
Two-color self-aligned double patterning (SADP) to yield static random access me2025
Hard mask removal without damaging top epitaxial layer2025
Bake devices for handling and uniform baking of substrates2025
Die system and method of comparing alignment vectors2024
Lithography method to form structures with slanted angle2024
Structure and method to pattern pitch lines2024
X-ray shielding structure for a chip2024