Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit package with cavity in substrate

Integrated circuit package with cavity in substrate

US Patent 9196575 · Granted Nov 24, 2015

Estimated economic value: $22,670,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Boiling enhancement structures for immersion cooled electronic systems2025
Methods for manufacturing semiconductor structures including isolation layer and2024
Semiconductor structure manufacturing method and two semiconductor structures2024
Gan rectifier suitable for operating under 35GHZ alternating-current frequency, 2022
Socket with thermal conductor2022
Semiconductor device and method of manufacturing the same2021
Field plate power device and method of manufacturing the same2019
Power semiconductor device and method for manufacturing the same2018
High speed turbo decoder2018
Field plate power device and method of manufacturing the same2018
Integrated circuit packages with detachable interconnect structures2018
Tranmission line bridge interconnects2017