Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Through wire interconnect (TWI) for semiconductor components having wire in via and bonded connection with substrate contact

Through wire interconnect (TWI) for semiconductor components having wire in via and bonded connection with substrate contact

US Patent 9013044 · Granted Apr 21, 2015

Estimated economic value: $30,147,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor devices with redistribution structures configured for switchable r2025
Semiconductor device assembly with die support structures2024
Semiconductor devices with redistribution structures configured for switchable r2023
Methods of manufacturing stacked semiconductor die assemblies with high efficien2023
Apparatuses and methods for internal heat spreading for packaged semiconductor d2022
Stacked semiconductor die assemblies with high efficiency thermal paths and mold2022
Semiconductor devices with redistribution structures configured for switchable r2021
Semiconductor device assembly with die support structures2021
Stacked semiconductor die assemblies with improved thermal performance and assoc2019
Stacked semiconductor die assemblies with high efficiency thermal paths and mold2019
Methods of manufacturing stacked semiconductor die assemblies with high efficien2018
Semiconductor constructions2018