Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Interconnection structure for semiconductor package

Interconnection structure for semiconductor package

US Patent 9013042 · Granted Apr 21, 2015

Estimated economic value: $3,183,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic package and manufacturing method thereof2025
Electronic package and manufacturing method thereof2025
Electronic package and carrier thereof and method for manufacturing the same2025
Electronic package and manufacturing method thereof2025
Method for fabricating electronic package2024
Electronic package and fabrication method thereof2024
Electronic package, heat dissipation structure and manufacturing method thereof2024
Electronic package and carrier thereof and method for manufacturing the same2024
Electronic package and manufacturing method thereof2024
Method of manufacturing substrate structure with filling material formed in conc2024
Method of manufacturing substrate structure with filling material formed in conc2024
Electronic package and manufacturing method thereof2023