Apparatus and method for integration of through substrate vias

Assignee

• SUNY Research Foundation

Inventors

• Jeremiah Hebding (3 patents)
• Megha Rao (2 patents)
• Colin Albright McDonough (12 patents)
• Matthew David Smalley (158 patents)
• Douglas D. Coolbaugh (145 patents)
• Joseph Piccirillo, Jr. (2 patents)
• Stephen G. Bennett (1 patents)
• Unknown
• Daniel Pascual (4 patents)

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