Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for controlling spatial temperature distribution across a semiconductor wafer

Method for controlling spatial temperature distribution across a semiconductor wafer

US Patent 8963052 · Granted Feb 24, 2015

Estimated economic value: $37,061,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Enhanced closed loop gas based heat exchange2025
Control of plasma formation by RF coupling structures2025
Magnetic shielding for plasma sources2025
Compact high density plasma source2025
Cooling for a plasma-based reactor2023
Magnetic shielding for plasma sources2021
Ceramic layer for electrostatic chuck including embedded faraday cage for RF del2021
Maintenance mode power supply system2021
Electrostatic chuck including clamp electrode assembly forming portion of Farada2021
High-power radio-frequency spiral-coil filter2020
Power switching system for ESC with array of thermal control elements2020
Substrate support with thermal zones for semiconductor processing2020