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Home › Multi-layer circuit substrate fabrication method providing improved transmission line integrity and increased routing density

Multi-layer circuit substrate fabrication method providing improved transmission line integrity and increased routing density

US Patent 8962475 · Granted Feb 24, 2015

Estimated economic value: $3,851,000 ⓘ

Assignee

IBM

Inventors

Sungjun Chun (39 patents)
Anand Haridass (90 patents)
Roger D. Weekly (60 patents)

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