Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit packaging system having dual sided connection and method of manufacture thereof

Integrated circuit packaging system having dual sided connection and method of manufacture thereof

US Patent 8906740 · Granted Dec 9, 2014

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Printed circuit board2025
Printed circuit board2025
Pharmaceutical composition comprising THA as active ingredient for treating brea2023
Printed circuit board and electronic component package2023
Printed circuit board and electronic component package2023
Camera module with droplet removing device2023
Apparatus and method for inspecting ventilation2022
Electrostatic discharge handling for sense IGBT using Zener diode2021
Hydraulic pressure supply system of automatic transmission for hybrid vehicle an2020
Reverse power reducing method and plasma power apparatus using the same2019
High-frequency power generator with enhanced pulse function2019
Solenoid valve2018