Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package substrate in particular for MEMS devices

Semiconductor package substrate in particular for MEMS devices

US Patent 8854830 · Granted Oct 7, 2014

Estimated economic value: $1,525,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package with wettable flank2025
Exoskeleton for upper arm2025
Optimized task generation and scheduling of automated guided carts using overhea2025
Semiconductor device with electrical component for bridging leadframe and chip m2025
Current transducer2025
Semiconductor device and corresponding method of manufacture2024
Method of manufacturing semiconductor devices with a paddle and electrically con2024
Semiconductor device and corresponding manufacturing method2024
Exoskeleton for upper arm2024
Method of manufacturing semiconductor devices and corresponding semiconductor de2023
Pressure sensing device with cavity and related methods2023
Semiconductor device including electrical component connecting a semiconductor c2023