Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device with electrical component for bridging leadframe and chip mounting portion and corresponding method of manufacture

Semiconductor device with electrical component for bridging leadframe and chip mounting portion and corresponding method of manufacture

US Patent 12300585 · Granted May 13, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device and corresponding method of manufacture2024
Semiconductor device and corresponding method2024
Semiconductor device and corresponding manufacturing method2024
Semiconductor device and corresponding manufacturing method2024
Semiconductor device including electrical component connecting a semiconductor c2023
Semiconductor device including electrical component connecting a semiconductor c2023
Semiconductor device including electrical component connecting a semiconductor c2023
Assortment of substrates for semiconductor circuits, corresponding assortment of2023
Semiconductor device and corresponding method2023
Method of manufacturing semiconductor devices and corresponding semiconductor de2022
Method of manufacturing semiconductor devices and corresponding semiconductor de2022
Semiconductor device and corresponding method2021