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Home › Chip packages including through-silicon via dice with vertically inegrated phased-array antennas and low-frequency and power delivery substrates

Chip packages including through-silicon via dice with vertically inegrated phased-array antennas and low-frequency and power delivery substrates

US Patent 8816906 · Granted Aug 26, 2014

Estimated economic value: $15,304,000 ⓘ

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