Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Polyimides and fluoropolymer bonding layer with improved copper heat seal strength

Polyimides and fluoropolymer bonding layer with improved copper heat seal strength

US Patent 8816217 · Granted Aug 26, 2014

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Current inverter2024
Generator electric2024
Equipment for control of electric power2024
Fuel tank with support pillar2024
Defense method and an application against adversarial examples based on feature 2024
Power supply unit2023
Power supply unit universal2023
Equipment for control of electric power2023
Charging station2023
Power supply unit universal2023
Power supply unit universal2023
Generator electric2023