Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8816217 | Polyimides and fluoropolymer bonding layer with improved copper heat seal strength | Haibin Zheng, Blair Jones, Manish Maheshwari, Toshinori Mizuguchi | 2014-08-26 |
| 8530746 | Polyimides and fluoropolymer bonding layer with improved internal adhesive strength | Haibin Zheng, Grant Richard Lee | 2013-09-10 |